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this is information on a product in full production. july 2013 docid15487 rev 8 1/17 SD4933 hf/vhf/uhf rf power n-channel mosfet datasheet - production data figure 1. pin connection features ? improved ruggedness v (br)dss > 200 v ? excellent thermal stability ? 20:1 all phases load mismatch capability ? p out = 300 w min. with 24 db gain @ 30 mhz ? in compliance with the 2002/95/eec european directive description the SD4933 is an n-channel mos field-effect rf power transistor. it is intended for use in 50 v ism applications up to 100 mhz. 1 3 4 2 1. drain 2. source 3. gate 4. source 5. source 5 m177 epoxy sealed table 1. device summary order code marking base qty. package packaging SD4933 SD4933 (1) 25 pcs m177 plastic tray 1. for more details please refer to chapter 9: marking, packing and shipping specifications . www.st.com
contents SD4933 2/17 docid15487 rev 8 contents 1 electrical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 1.1 maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 1.2 thermal data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 2 electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 2.1 static . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 2.2 dynamic . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 3 impedance data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 4 typical performance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 5 typical performance (30 mhz) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 5.1 test circuit (30 mhz) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 6 circuit layout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 7v gs /g fs sorts . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 8 package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 9 marking, packing and shipping specifications . . . . . . . . . . . . . . . . . . . 15 10 revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
docid15487 rev 8 3/17 SD4933 electrical data 17 1 electrical data 1.1 maximum ratings (t case = 25 c) 1.2 thermal data table 2. absolute maximum ratings symbol parameter value unit v (br)dss drain source voltage 200 v v dgr drain-gate voltage (r gs = 1 m )200v v gs gate-source voltage 20 v i d drain current 40 a p diss power dissipation 648 w e as avalanche energy single pulse (i d = 56 a - 800 h coil) 1200 mj t j max. operating junction temperature 200 c t stg storage temperature -65 to +150 c table 3. thermal data symbol parameter value unit r thjc junction - case thermal resistance 0.27 c/w
electrical characteristics SD4933 4/17 docid15487 rev 8 2 electrical characteristics t case = +25 o c 2.1 static 2.2 dynamic table 4. static symbol test conditions min typ max unit v (br)dss v gs = 0 v i ds = 100 ma 200 240 v i dss v gs = 0 v v ds = 100 v 2 ma i gss v gs = 20 v v ds = 0 v 500 na v gs(q) v ds = 10 v i d = 250 ma 2.5 3.75 v v ds(on) v gs = 10 v i d = 20 a 3.5 4.0 v g fs v ds = 10 v i d = 5 a 10 14 s c iss v gs = 0 v v ds = 50 v f = 1 mhz 1000 pf c oss v gs = 0 v v ds = 50 v f = 1 mhz 400 pf crss v gs = 0 v v ds = 50 v f = 1 mhz 16 pf table 5. dynamic symbol test conditions min typ max unit p out v dd = 50 v i dq = 250 ma f = 30 mhz 300 - w g ps v dd = 50 v i dq = 250 ma p out = 300 w f = 30 mhz 20 24 - db h d v dd = 50 v i dq = 250 ma p out = 300 w f = 30 mhz 50 58 - % load mismatch v dd = 50 v i dq = 250 ma p out = 300 w f = 30 mhz all phase angles 10:1 20:1 - vswr
docid15487 rev 8 5/17 SD4933 impedance data 17 3 impedance data figure 2. impedance data table 6. impedance values z in z dl 1.6 - j 5.0 3.3 + j 1.0 = '/ ' 6 = ,1 * 7\slfdo,qsxw ,pshg dqfh 7\slfdo'udlq /rdg,pshgdqfh $09
typical performance SD4933 6/17 docid15487 rev 8 4 typical performance figure 3. capacitance vs. drain voltage figur e 4. drain current vs. drain-source voltage figure 5. drain current vs. drain-source voltage at different temperatures 0 200 400 600 800 1000 1200 1400 01020304050 capacitance (pf) drain-source voltage (v) cgs cgd cds am09243v1 0 5 10 15 20 25 30 35 02468 ids (a) vds (v) 10 am09244v1 0 5 10 15 20 25 30 35 40 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0 ids (a) vgs (v) 25c 80c -20c am09245v1
docid15487 rev 8 7/17 SD4933 typical performance 17 figure 6. transient thermal impedance 0.00 0.05 0.10 0.15 0.20 0.25 0.30 1.e -04 1.e -03 1.e -02 1.e -01 1.e+00 thermal impedance - zth j-c (c / w) rectangular power pulse width (sec) single pulse 10% 20% 30% 40% 50% 60% single -repetitive pulse am09280v2
typical performance SD4933 8/17 docid15487 rev 8 figure 7. transient th ermal impedance model $09 & & & ) & & & ) & & & ) & & & ) 5 5 5 2kp 5 5 5 2kp 5 5 5 2kp 5 5 5 2kp 'lvvlsdwhg3rzhu:dwwv
docid15487 rev 8 9/17 SD4933 typical performance (30 mhz) 17 5 typical performance (30 mhz) figure 8. gain and efficiency vs. output power_vdd = 50 v, idq = 250 ma, freq = 30 mhz figure 9. output power vs. input power figure 10. output power vs. supply voltage figure 11. output power vs. gate voltage 10 20 30 40 50 60 70 80 14 16 18 20 22 24 26 28 0 50 100 150 200 250 300 350 400 450 efficiency (%) power gain (db) output power (w) pgain efficiency am09248v2 0 50 100 150 200 250 300 350 400 450 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 pout (w) pin (w) 50 v 40 v am09246v1 100 150 200 250 300 350 400 25 30 35 40 45 50 pout (w) vdd (v) pin = 2.8w pin = 1.4w am09247v1 0 100 200 300 400 500 -3 -2 -1 0 1 2 3 4 pout (w) vgs (v) p i n = 2 . 8 w am09248v1
typical performance (30 mhz) SD4933 10/17 docid15487 rev 8 5.1 test circuit (30 mhz) figure 12. 30 mhz test circuit schematic table 7. transmission line dimensions dim. inch mm a 0.532 13.51 b 0.250 6.35 c 0.181 4.59 d 0.383 9.37 e 0.351 8.91 f 0.633 16.08 g 0.477 12.12 h 0.438 11.12 j 0.200 5.08 k 0.164 4.16 l 0.174 4.42 m 0.817 20.75 n 0.350 8.89 p 0.779 19.79 r 0.639 16.23
docid15487 rev 8 11/17 SD4933 typical performance (30 mhz) 17 s 0.165 4.19 t 1.017 25.84 u 0.375 9.52 v 0.456 11.58 w 0.325 8.24 x 0.650 16.50 table 8. 30 mhz test circuit component list component description c1,c9 0.01 f / 500 v surface mount ceramic chip capacitor c2, c3 750 pf atc 700b surface mount ceramic chip capacitor c4 300 pf atc 700b surface mo unt ceramic chip capacitor c5,c10,c11,c14,c16 10000 pf atc 200b surface mount ceramic chip capacitor c6 510 pf atc 700b surface mo unt ceramic chip capacitor c7 300 pf atc 700b surface mo unt ceramic chip capacitor c8 175-680 pf type 46 standard trimmer capacitor c12 47 f / 63 v aluminum electrolytic radial lead capacitor c13 1200 pf atc 700b surface mount ceramic chip capacitor c15 100 f / 63 v aluminum electrolytic radial lead capacitor r1,r3 1 k, 1 w surface-mount chip resistor r2 560 2 w wire-wound axis lead resistor t1 hf 2-30 mhz surface mount 9:1 transformer t2 rg - 142b/u 50 coaxial cable od = 0.165[4.18] l 15?[381.00] covered with 15? [381.00] tinned copper t ubular brand 13/65? [5.1] width l1 1 3/4 turn air-wound 16 awg id = 0. 219 [5.56] poly-coated magnet wire l2 1 3/4 turn air-wound 12 awg id = 0.250 [6.34] bus bar wire rfc1,rfc2 3 turns 14 awg wire through ferrite toroid fb1 surface mount emi shield bead fb2 toroid pcb ultralam 2000. 0.030? thk, r = 2.55, 2 oz ed cu both sides table 7. transmission line dimensions (continued) dim. inch mm
circuit layout SD4933 12/17 docid15487 rev 8 6 circuit layout figure 13. test fixture component layout figure 14. test circuit photomasters sd 4933 4 4
docid15487 rev 8 13/17 SD4933 vgs/gfs sorts 17 7 v gs /g fs sorts table 9. v gs /g fs sorts marking v gs (min) v gs (max) g fs (min) g fs (max) e6 2.50 2.75 10 11 e7 2.50 2.75 11 12 e8 2.50 2.75 12 13 e9 2.50 2.75 13 14 f6 2.75 3.00 10 11 f7 2.75 3.00 11 12 f8 2.75 3.00 12 13 f9 2.75 3.00 13 14 g6 3.00 3.25 10 11 g7 3.00 3.25 11 12 g8 3.00 3.25 12 13 g9 3.00 3.25 13 14 h6 3.25 3.50 10 11 h7 3.25 3.50 11 12 h8 3.25 3.50 12 13 h9 3.25 3.50 13 14 i6 3.50 3.75 10 11 i7 3.50 3.75 11 12 i8 3.50 3.75 12 13 i9 3.50 3.75 13 14
package mechanical data SD4933 14/17 docid15487 rev 8 8 package mechanical data in order to meet environmental requirements, st offers these devices in different grades of ecopack ? packages, depending on their level of environmental compliance. ecopack ? specifications, grade definitions a nd product status are available at: www.st.com . ecopack is an st trademark. figure 15. package dimensions table 10. m177 (.550 dia 4/l n/herm w/flg) mechanical data dim. mm. inch min typ max min typ max a 5.72 5.97 0.225 0.235 b 6.73 6.96 0.265 0.275 c 21.84 22.10 0.860 0.870 d 28.70 28.96 1.130 1.140 e 13.84 14.10 0.545 0.555 f 0.08 0.18 0.003 0.007 g 2.49 2.74 0.098 0.108 h 3.81 4.32 0.150 0.170 i 7.11 0.280 j 27.43 28.45 1.080 1.120 k 15.88 16.13 0.625 0.635 gapmsmd00039 controlling dimension: inches
docid15487 rev 8 15/17 SD4933 marking, packing and shipping specifications 17 9 marking, packing and shipping specifications figure 16. marking layout table 11. packing and shipping specifications order code packaging pcs per tray dry pack humidity v gs and g fs code lot code SD4933 plastic tray 25 < 10% not mixed not mixed table 12. marking specifications symbol description xv gs and g fs sort cz assembly plant xxx last 3 digits of diffusion lot vy diffusion plant mar country of origin cz test and finishing plant y assembly year yy assembly week SD4933
revision history SD4933 16/17 docid15487 rev 8 10 revision history table 13. document revision history date revision changes 11-mar-2009 1 initial release 24-feb-2010 2 updated table 9: v gs /g fs sorts on page 13 . 29-sep-2010 3 document status promot ed from preliminary to datasheet. 06-apr-2011 4 inserted section 3: impedance data , section 4: typical performance , section 6: circuit layout and section 9: marking, packing and shipping specifications . 24-may-2011 5 inserted figure 6: transient thermal impedance , figure 7: transient thermal impedance model and section 9: marking, packing and shipping specifications . 11-aug-2011 6 ?e as parameter inserted in table 2: absolute ma ximum ratings on page 3 . ? minor text changes. 10-jun-2013 7 ? corrected error in v gs(q) symbol and test conditions in ta ble 4: static . ? minor text edits. 01-jul-2013 8 ? modified the v gs(q) and g fs values in ta ble 4: sta tic . ? reduced the number of entries in table 9: v gs /g fs sorts to include only the relevant selection codes.
docid15487 rev 8 17/17 SD4933 17 please read carefully: information in this document is provided solely in connection with st products. stmicroelectronics nv and its subsidiaries (?st ?) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described he rein at any time, without notice. all st products are sold pursuant to st?s terms and conditions of sale. purchasers are solely responsible for the choice, selection and use of the st products and services described herein, and st as sumes no liability whatsoever relating to the choice, selection or use of the st products and services described herein. no license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. i f any part of this document refers to any third party products or services it shall not be deemed a license grant by st for the use of such third party products or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoev er of such third party products or services or any intellectual property contained therein. unless otherwise set forth in st?s terms and conditions of sale st disclaims any express or implied warranty with respect to the use and/or sale of st products including without limitation implied warranties of merchantability, fitness for a parti cular purpose (and their equivalents under the laws of any jurisdiction), or infringement of any patent, copyright or other intellectual property right. st products are not authorized for use in weapons. nor are st products designed or authorized for use in: (a) safety critical applications such as life supporting, active implanted devices or systems with product functional safety requirements; (b) aeronautic applications; (c) automotive applications or environments, and/or (d) aerospace applications or environments. where st products are not designed for such use, the purchaser shall use products at purchaser?s sole risk, even if st has been informed in writing of such usage, unless a product is expressly designated by st as being intended for ?automotive, automotive safety or medical? industry domains according to st product design specifications. products formally escc, qml or jan qualified are deemed suitable for use in aerospace by the corresponding governmental agency. resale of st products with provisions different from the statements and/or technical features set forth in this document shall immediately void any warranty granted by st for the st product or service described herein and shall not create or extend in any manner whatsoev er, any liability of st. st and the st logo are trademarks or registered trademarks of st in various countries. information in this document supersedes and replaces all information previously supplied. the st logo is a registered trademark of stmicroelectronics. all other names are the property of their respective owners. ? 2013 stmicroelectronics - all rights reserved stmicroelectronics group of companies australia - belgium - brazil - canada - china - czech republic - finland - france - germany - hong kong - india - israel - ital y - japan - malaysia - malta - morocco - philippines - singapore - spain - sweden - switzerland - united kingdom - united states of america www.st.com

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